System Palette
Epoxy, zinc-rich, polyurethane stacks
Acrylic and hybrid chemistries for clean air permits
Epoxy and hybrid assembly bonding systems
Elastomeric, fire-retardant, and fillers
Cleaners, conversion coatings, maintenance kits
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Structural Bonding for Demanding Assemblies
Epoxy and hybrid adhesives engineered for high-shear joints, dissimilar materials, and high-speed OEM production—validated with TDS, SDS, and process windows.
Performance Focus
- Structural strength with fatigue and impact resistance
- Thixotropic and gap-filling options for complex joints
- Room-temperature and accelerated cure profiles
- Excellent adhesion to metals, composites, plastics
Specification Kit
Color-Coded Data Sheets and Inspection Steps
Every family carries a matching swatch, label, and TDS/SDS bundle to keep purchasers, applicators, and inspectors synchronized.
- Surface prep and DFT targets for QA/QC teams
- Mixing, pot life, and cure windows by product
- Custom formulation pathway for unique substrates
Fast Actions
Portfolio
Bonding Solutions by Application
High-Shear, High-Strength
- Two-component system with controlled open time
- Excellent adhesion to metals and composites
- High shear and peel resistance for load paths
Best for: Structural joints & brackets
Flexible & Fast Cure
- Balances flexibility with strong bond strength
- Low shrink, reduced print-through on panels
- Fast handling strength for line throughput
Best for: Mixed materials & enclosures
EMI/ESD Considerations
- Conductive fillers for EMI/ESD-sensitive builds
- Bond and shield in a single step
- Stable viscosity for automated dispensing
Best for: Electronics housings
Process Alignment
Built for Fast Lines and Repeatability
- Dispense-friendly rheology for manual or automated application
- Open time and clamp time tuned to station cadence
- Detailed cure profiles for room-temp or oven assist
- Surface prep guides to maximize adhesion consistency
Technical Snapshot
| Product | Type | Key Properties | Use |
|---|---|---|---|
| Structural Epoxy | 2K epoxy | High shear/peel, controlled open time | Structural bonding of metals/composites |
| Hybrid Adhesive | Hybrid polymer | Flexibility, low shrink, fast handling strength | Assemblies with movement or vibration |
| Conductive Adhesive | Conductive filler system | EMI/ESD performance, stable rheology | Electronics and sensitive enclosures |
Detailed mix ratios, pot life, and cure profiles are provided in each TDS. SDS outlines handling, PPE, and ventilation requirements.